International Conference on Mechanical, Electric and Industrial Engineering ---- Hangzhou, China, May 26-28, 2018
About conference

The International Conference on Mechanical, Electric and Industrial Engineering (MEIE2018) will be held in Hangzhou, China during May 26-28, 2018.

MEIE 2018 aims to provide a forum for scholars,researchers and participants all over the world to exchange their ideas and experiences. The conference is dedicated to cover all theoretical and experimental aspects of mechanical, electric and industrial engineering.

News

MEIE 2018 has been included in cnki.

MEIE 2018 has been included in ScienceNet.cn.

MEIE 2018 begins to call for papers, welcome scholars and experts from home and abroad to submit manuscript and attend the conference. Thanks for your support to our conference.

Publication and Index
Journal of Physics: Conference Series (IOP Publishing: JPCS)
Online ISSN: 1742-6596
Print ISSN: 1742-6588
Index: EI Compendex, CPCI, Scopus, etc.
Keynote Speaker View more
Nader Asnafi
Professor
Mechanical Engineering, Örebro University, Sweden
Speech Title: 3D Metal Printing from an Industrial Perspective–Product Examples, Production and Business Models
Hongfa (Henry) Hu
Full Professor
Department of Mechanical, Automotive & Materials Engineering, University of Windsor, Canada
Speech Title: Microstructure-dependent Mechanical Behavior of High Pressure Die Cast Magnesium Alloys
Jin-Woo Ahn
Professor
Department of Mechatronics Engineering, Kyungsung University, Korea
Speech Title: Switched Reluctance Motor and Drives
Latest accepted papers View more
Update time: April 12th, 2018
MEIE15534:
Modal analysis and optimization of bus body structure
Song Deng, Xinghui Han, Lei Yang
MEIE15645:
Structure design and parameters calculate of suspension system test bench
J Q Zhang, X Y Wang, J F Jia, L Zhang and X Li
MEIE15451:
Research on fast grouping slice algorithm for STL model in rapid prototyping
Renqiang Tian, Shaogang Liu and Yifei Zhang
MEIE11324:
Analysis of high-temperature aging and microstructure of FC LED solder joints of a silver conductive layer bonded using SAC solder
Mengtian Li, Jun Zou, Wengjuan Wu, Nan Jiang, Yiming Liu, Liping Wang, Mingming Shi and Wenbo Li
MEIE16106:
A novel quality test method of electricity meter lcd screen based on image processing
Ruipeng Song, Qixin Cai, Zhongdong Wang, Huiling Su, Xuesong Shao, Wei Li, Ping Jin
Countdown 34 Days
Important Dates
Submission due: April 20, 2018
Conference date: May 26-28, 2018
Contact Us
Email: meie@a-scie.org
Tel: +86-13018056523
QQ: 2060402500
Sponsor
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